Company News & Industry Insights
Mingyuan Automation showcased its lineup of ultrasonic aluminum wire bonding equipment at the IICIE 2026 exhibition, booth 14A69, and secured export partnerships with Southeast Asian clients, marking the official entry into overseas markets.
The next-generation Wedge Bond series delivers significant breakthroughs in bonding accuracy, production efficiency, and operational stability, fully meeting the automotive-grade packaging requirements for power semiconductors.
Following recognition as a National High-Tech Enterprise, the company has now been certified as a Provincial Specialized and New SME, further demonstrating its technical strength.
Ultrasonic aluminum wire bonding, with its advantages of high conductivity and reliable connections, is widely adopted in energy storage cell interconnection and battery control system welding.
Continuously optimize our three core business segments—new energy equipment, semiconductor bonding machinery, and custom automation—to deliver end-to-end service capabilities.
